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Information
- 112-layer 3D BiCS FLASH technology for increased storage density and reliability
- Host Memory Buffer (HMB) feature enhances speed without additional DRAM
- Supports NVM Express (NVMe) 1.4 for faster and more efficient data access
- Includes sanitize command for secure data deletion when needed
- Designed for longevity with an MTBF of 1,500,000 hours
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Specifikation
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